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This conductive masterbatch is a premium carbon black-filled functional masterbatch engineered to impart reliable electrical conductivity to plastic products. It appears as black free-flowing granules and is specifically designed for the production of electronic carrier tapes (IC carrier tape / chip carrier tape), ESD packaging, anti-static trays, and other electronic component packaging applications.
The product utilizes high-purity conductive carbon black as the conductive filler, combined with a carefully selected polymer carrier resin (PS / PC / ABS, customizable) and advanced compounding technology. When blended with the base resin, it forms a permanent conductive network within the plastic matrix, enabling effective electrostatic discharge (ESD) protection and static dissipation.
The masterbatch is suitable for extrusion and injection molding processes and is widely applied in semiconductor packaging lines, SMT assembly lines, and other static-sensitive environments.
Key Features & Benefits
Reliable Conductivity - Provides stable and uniform surface resistivity (103-1011Ω/sq(customizable)), meeting ESD protection requirements for sensitive electronic components.
Excellent Compatibility - Well-compatible with PS, HIPS, ABS, PP, and other thermoplastic resins.
Permanence - The conductive function is permanent throughout the product's service life, not dependent on humidity conditions.
Good Dispersion - Advanced twin-screw extrusion process ensures uniform dispersion of carbon black in the polymer matrix.
Clean Performance - Low dust generation, suitable for cleanroom production environments.
Easy Processing - Can be processed under standard conditions using conventional extrusion and injection molding equipment.
Typical Technical Parameters
Parameters below are representative values for reference. Tailored specifications available upon request.
| Application Industry | Specific Application Scenarios | Core Requirements |
|---|---|---|
| Electronics & Electrical | 1. Packaging for electronic components (carrier tapes, pallets, blister boxes) 2. PCB brackets/bases 3. Connectors, switch components 4. Electromagnetic shielding cases, antistatic housings |
Antistatic properties, electromagnetic shielding, balance of insulation and conductivity, dimensional stability |
| Semiconductor Manufacturing | 1. Wafer transport pallets 2. Internal components of lithography/etching machines 3. Cleanroom tools/containers |
Ultra-high cleanliness, antistatic properties, chemical resistance (to photoresist/etching solutions), high-temperature resistance (>200°C) |
| Automotive Electronics | 1. Housings for in-vehicle electronic modules (e.g., ECUs, sensors) 2. Battery components (battery cases, electrode supports) 3. Antenna shielding parts in automobiles |
Resistance to high/low temperatures (-40°C~150°C), oil/aging resistance, vibration resistance, compliance with automotive flame-retardant standards (e.g., UL94 V-0) |
| Aerospace | 1. Antistatic components for avionics 2. Electromagnetic shielding covers for satellite instruments 3. Conductive components in radar systems |
Lightweight, high strength, radiation resistance, tolerance to extreme temperatures (-200°C~300°C), compliance with aerospace material flame-retardant and environmental standards |
| Precision Instruments | 1. Antistatic pallets for laboratory analytical instruments 2. Electronic components of medical devices (e.g., MRI shielding parts) 3. Conductive brackets for optical instruments |
Low dust emission, high surface resistivity stability, disinfectant resistance (e.g., alcohol/high-temperature sterilization for medical scenarios) |
| Packaging Industry | 1. Moisture-proof and antistatic packaging bags for high-precision electronic components 2. Food-grade antistatic transfer boxes (e.g., for semiconductor-related food packaging) 3. LCD panel transport pallets |
Moisture-proof, dust-proof, antistatic migration resistance, compliance with food contact safety standards (e.g., FDA certification) |
| Communication Equipment | 1. Electromagnetic shielding layers for 5G base station antenna covers 2. Conductive components for fiber optic connectors 3. Antistatic floors/racks in server rooms |
High-frequency electromagnetic shielding (above 1GHz), heat dissipation, UV aging resistance, compliance with flame-retardant requirements for communication equipment |
| New Energy | 1. Conductive additives for lithium battery anodes/cathodes 2. Antistatic components for photovoltaic junction boxes 3. Conductive structural parts inside charging piles |
High conductivity (volume resistivity ≤10³ Ω·cm), electrolyte corrosion resistance, high-temperature resistance (battery operating conditions above 100°C) |
| Consumer Electronics | 1. EMI shielding parts inside mobile phones/laptops 2. Conductive buttons for smart watches 3. Antistatic casings for tablets |
Ultra-thinness (thickness ≤0.5mm), high surface gloss, wireless charging compatibility (low dielectric constant) |
| Industrial Manufacturing | 1. Conductive components for automation equipment sensors 2. Antistatic guide rails for precision machinery 3. Static discharge components for industrial robots |
Wear/scratch resistance, mechanical stress resistance, long-term weatherability (UV resistance for outdoor use) |
Processing Guidelines
Drying: Not required typically. If moisture is present, dry at 70-80°C for 2-3 hours.
Mixing: Pre-mix the masterbatch with the base resin (e.g., HIPS or PS) at the recommended ratio.
Extrusion Temperature: 180-240°C (adjust according to the base resin).
Injection Molding / Sheet Extrusion: Follow standard processing parameters of the base resin.
Note: Processing conditions may vary by equipment. Optimization is recommended before mass production.
Quality Assurance
Available with technical datasheet (TDS) and Material Safety Data Sheet (MSDS)
Compliance verification available: RoHS and REACH upon request
Third-party testing report available upon request
ISO quality management system certified
ESD testing performed in accordance with ANSI/ESD S20.20 and IEC 61340-5-1 standards
Packaging & Delivery
Standard packaging: 25 kg/bag (kraft paper bag with PE liner, or customized)
Custom options: 500 kg/1000 kg FIBC (jumbo bag) available
Shelf life: 12 months when stored in a cool, dry place (temperature below 40°C, humidity below 70%)
HS code reference: 3824999990 (functional masterbatch) or any updated category based on your materials
Note: Export packaging available for overseas shipments. Please contact us for current HS code in your region.
Customization & After-Sales
Customization available - Carrier resin (PS / HIPS / ABS / PP / Others), conductivity level (surface resistance from 103 Ω to 109 Ω), MFI, and appearance can all be customized
Technical support - Our R&D team provides application testing and process optimization guidance
Samples available - Free samples for qualified inquiries (shipping fee to be borne by buyer)
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