High-Performance Conductive PS/ABS Master Batch - Black Master Batch, for IC Carrier Tape and Anti-Static Plastic Parts

Product Description

 
PC PS electronic carrier tapes USE Conductive black plastic modified materials  PLASTIC

Product Description

This conductive masterbatch is a premium carbon black-filled functional masterbatch engineered to impart reliable electrical conductivity to plastic products. It appears as black free-flowing granules and is specifically designed for the production of electronic carrier tapes (IC carrier tape / chip carrier tape), ESD packaging, anti-static trays, and other electronic component packaging applications.

The product utilizes high-purity conductive carbon black as the conductive filler, combined with a carefully selected polymer carrier resin (PS / PC / ABS, customizable) and advanced compounding technology. When blended with the base resin, it forms a permanent conductive network within the plastic matrix, enabling effective electrostatic discharge (ESD) protection and static dissipation.

The masterbatch is suitable for extrusion and injection molding processes and is widely applied in semiconductor packaging lines, SMT assembly lines, and other static-sensitive environments.

Detailed Photos

 

Key Features & Benefits

• Reliable Conductivity - Provides stable and uniform surface resistivity (10310³-10610¹¹Ω/sq(customizable)), meeting ESD protection requirements for sensitive electronic components.

• Excellent Compatibility - Well-compatible with PS, HIPS, ABS, PP, and other thermoplastic resins.

• Permanence - The conductive function is permanent throughout the product's service life, not dependent on humidity conditions.

• Good Dispersion - Advanced twin-screw extrusion process ensures uniform dispersion of carbon black in the polymer matrix.

• Clean Performance - Low dust generation, suitable for cleanroom production environments.

• Easy Processing - Can be processed under standard conditions using conventional extrusion and injection molding equipment.

Typical Technical Parameters

Parameters below are representative values for reference. Tailored specifications available upon request.

 

Application

 

Application Industry	Specific Application Scenarios	Core Requirements
Electronics & Electrical	1. Packaging for electronic components (carrier tapes, pallets, blister boxes) 2. PCB brackets/bases 3. Connectors, switch components 4. Electromagnetic shielding cases, antistatic housings	Antistatic properties, electromagnetic shielding, balance of insulation and conductivity, dimensional stability
Semiconductor Manufacturing	1. Wafer transport pallets 2. Internal components of lithography/etching machines 3. Cleanroom tools/containers	Ultra-high cleanliness, antistatic properties, chemical resistance (to photoresist/etching solutions), high-temperature resistance (>200°C)
Automotive Electronics	1. Housings for in-vehicle electronic modules (e.g., ECUs, sensors) 2. Battery components (battery cases, electrode supports) 3. Antenna shielding parts in automobiles	Resistance to high/low temperatures (-40°C~150°C), oil/aging resistance, vibration resistance, compliance with automotive flame-retardant standards (e.g., UL94 V-0)
Aerospace	1. Antistatic components for avionics 2. Electromagnetic shielding covers for satellite instruments 3. Conductive components in radar systems	Lightweight, high strength, radiation resistance, tolerance to extreme temperatures (-200°C~300°C), compliance with aerospace material flame-retardant and environmental standards
Precision Instruments	1. Antistatic pallets for laboratory analytical instruments 2. Electronic components of medical devices (e.g., MRI shielding parts) 3. Conductive brackets for optical instruments	Low dust emission, high surface resistivity stability, disinfectant resistance (e.g., alcohol/high-temperature sterilization for medical scenarios)
Packaging Industry	1. Moisture-proof and antistatic packaging bags for high-precision electronic components 2. Food-grade antistatic transfer boxes (e.g., for semiconductor-related food packaging) 3. LCD panel transport pallets	Moisture-proof, dust-proof, antistatic migration resistance, compliance with food contact safety standards (e.g., FDA certification)
Communication Equipment	1. Electromagnetic shielding layers for 5G base station antenna covers 2. Conductive components for fiber optic connectors 3. Antistatic floors/racks in server rooms	High-frequency electromagnetic shielding (above 1GHz), heat dissipation, UV aging resistance, compliance with flame-retardant requirements for communication equipment
New Energy	1. Conductive additives for lithium battery anodes/cathodes 2. Antistatic components for photovoltaic junction boxes 3. Conductive structural parts inside charging piles	High conductivity (volume resistivity ≤10³ Ω·cm), electrolyte corrosion resistance, high-temperature resistance (battery operating conditions above 100°C)
Consumer Electronics	1. EMI shielding parts inside mobile phones/laptops 2. Conductive buttons for smart watches 3. Antistatic casings for tablets	Ultra-thinness (thickness ≤0.5mm), high surface gloss, wireless charging compatibility (low dielectric constant)
Industrial Manufacturing	1. Conductive components for automation equipment sensors 2. Antistatic guide rails for precision machinery 3. Static discharge components for industrial robots	Wear/scratch resistance, mechanical stress resistance, long-term weatherability (UV resistance for outdoor use)

Processing Guidelines

• Drying: Not required typically. If moisture is present, dry at 70-80°C for 2-3 hours.

• Mixing: Pre-mix the masterbatch with the base resin (e.g., HIPS or PS) at the recommended ratio.

• Extrusion Temperature: 180-240°C (adjust according to the base resin).

• Injection Molding / Sheet Extrusion: Follow standard processing parameters of the base resin.

Note: Processing conditions may vary by equipment. Optimization is recommended before mass production.

 

 

Certifications

Quality Assurance

• Available with technical datasheet (TDS) and Material Safety Data Sheet (MSDS)

• Compliance verification available: RoHS and REACH upon request

• Third-party testing report available upon request

• ISO quality management system certified

• ESD testing performed in accordance with ANSI/ESD S20.20 and IEC 61340-5-1 standards

 

Packaging & Shipping

 

Packaging & Delivery

• Standard packaging: 25 kg/bag (kraft paper bag with PE liner, or customized)

• Custom options: 500 kg/1000 kg FIBC (jumbo bag) available

• Shelf life: 12 months when stored in a cool, dry place (temperature below 40°C, humidity below 70%)

• HS code reference: 3824999990 (functional masterbatch) or any updated category based on your materials

• Note: Export packaging available for overseas shipments. Please contact us for current HS code in your region.

Customization & After-Sale

• Customization available - Carrier resin (PS / HIPS / ABS / PP / Others), conductivity level (surface resistance from 10310
  ³ Ω to 10910
   ¹⁰Ω), MFI, and appearance can all be customized

• Technical support - Our R&D team provides application testing and process optimization guidance